Nano-Interconnect Materials and Models for Next Generation Integrated Circuit Design

图书简介

Aggressive scaling of device and interconnect dimensions has resulted in many low dimensional issues in the nanometer regime. This book deals with various new generation interconnect materials and interconnect modeling and highlights the significance of novel nano interconnect materials for 3D integrated circuit design. It provides information about advanced nanomaterials like carbon nanotube (CNT) and graphene nanoribbon (GNR) for the realization of interconnects, interconnect models, and crosstalk noise analysis. Features:Focusses on materials and nanomaterials utilization in next generation interconnects based on Carbon nanotubes (CNT) and Graphene nanoribbons (GNR).Helps readers realize interconnects, interconnect models, and crosstalk noise analysis.Describes Hybrid CNT and GNR based interconnects.Presents the details of power supply voltage drop analysis in CNT and GNR interconnects.Overviews pertinent RF performance and stability analysis.This book is aimed at graduate students and researchers in electrical and materials engineering, nano/microelectronics.

1 Nanomaterials for Next-Generation Interconnects Aditya Tiwari, Sangeeta Jana Mukhopadhyay, and Sayan Kanungo 2 Interconnect Modeling Using Graphene Nanoribbon (GNR) Wen-Sheng Zhao 3 Introduction to Nanoscale Interconnect Materials Laxman Raju Thoutam and Shantikumar Nair 4 Analysis of Simultaneous Switching Noise and IR Drop Debaprasad Das, Mounika Bandi, Sandip Bhattacharya, and Subhajit Das 5 Temperature-Dependent RF Performance Analysis of GNR-Based Nano-Interconnect Systems Santasri Giri Tunga, Hafizur Rahaman, and Subhajit Das 6 Electro-Thermal Modeling of CNT and GNR Interconnect for Nano-Electronic Circuits Santasri Giri Tunga, Subhajit Das, and Hafizur Rahaman 7 Hybrid Cu-Carbon as Interconnect Materials and Their Interconnect Models Bhawana Kumari and Manodipan Sahoo 8 Hybrid Cu-CNT Composite as Interconnect Materials and Their Equivalent Models Shivangi Chandrakar and Manoj Kumar Majumder 9 Relative Stability Analysis of the GNR and Cu Interconnect Sandip Bhattacharya, L. M. I. Leo Joseph, Sheshikala Martha, Ch. Rajendra Prasad, Syed Musthak Ahmed, Subhajit Das, Debaprasad Das, and P. Anuradha 10 Transmission Line-Based Modeling of CNT and GNR Interconnects Using Numerical Methods Shashank Rebelli

Trade Policy 买家须知

关于产品：
● 正版保障：本网站隶属于中国国际图书贸易集团公司，确保所有图书都是100%正版。
● 环保纸张：进口图书大多使用的都是环保轻型张，颜色偏黄，重量比较轻。
● 毛边版：即书翻页的地方，故意做成了参差不齐的样子，一般为精装版，更具收藏价值。
关于退换货：
由于预订产品的特殊性，采购订单正式发订后，买方不得无故取消全部或部分产品的订购。
由于进口图书的特殊性，发生以下情况的，请直接拒收货物，由快递返回：
● 外包装破损/发错货/少发货/图书外观破损/图书配件不全（例如：光盘等）
并请在工作日通过电话400-008-1110联系我们。
签收后，如发生以下情况，请在签收后的5个工作日内联系客服办理退换货：
● 缺页/错页/错印/脱线
关于发货时间：
一般情况下：
●【现货】下单后48小时内由北京（库房）发出快递。
●【预订】【预售】下单后国外发货，到货时间预计5-8周左右，店铺默认中通快递，如需顺丰快递邮费到付。
● 需要开具发票的客户，发货时间可能在上述基础上再延后1-2个工作日（紧急发票需求，请联系010-68433105/3213）；
● 如遇其他特殊原因，对发货时间有影响的，我们会第一时间在网站公告，敬请留意。
关于到货时间：
由于进口图书入境入库后，都是委托第三方快递发货，所以我们只能保证在规定时间内发出，但无法为您保证确切的到货时间。
● 主要城市一般2-4天
● 偏远地区一般4-7天
关于接听咨询电话的时间：
010-68433105/3213正常接听咨询电话的时间为：周一至周五上午8：30～下午5：00，周六、日及法定节假日休息，将无法接听来电，敬请谅解。
其它时间您也可以通过邮件联系我们：customer@readgo.cn,工作日会优先处理。
关于快递：
● 已付款订单：主要由中通、宅急送负责派送，订单进度查询请拨打010-68433105/3213。

Nano-Interconnect Materials and Models for Next Generation Integrated Circuit Design 新一代集成电路设计的纳米互连材料与模型 工程热物理

Nano-Interconnect Materials and Models for Next Generation Integrated Circuit Design

新一代集成电路设计的纳米互连材料与模型
工程热物理