The first edition of this book was based on the author?s lecture notes that he developed over the course of nearly forty years of thermal design and analysis activity, the last fifteen years of which included teaching a university course at the senior undergraduate and graduate levels. The subject material was developed from publications of respected researchers and also includes topics and methods original to this author. Numerous students have contributed to both the first and second editions, the latter receiving corrections, rewritten sections (e.g. radiation spatial effects, Green?s function properties for thermal spreading, 1-D FEA theory and application) and some new material. The flavor and organization of the first edition has been retained whereby the reader is guided through the analysis process for systems and then components. Important new material has been added regarding altitude effects on forced and buoyancy driven airflow and heat transfer. The first twenty percent of the book is devoted to the prediction of airflow and well-mixed air temperatures in systems, circuit board channels, and heat sinks, followed by convective (PCB-mounted components included), radiative, and conductive heat transfer and the resultant temperatures in electronic equipment. Detailed application examples illustrate a variety of problems. Downloads (from CRC website): MathcadTM text examples, exercise solutions (adopting Professors only) plus PDF lecture aids (Professors only), and the tutorial (Chapter 14) Using free FEA software to solve a thermal spreading problem. Thermal Computations for Electronics is a valuable professional resource for self-study and is ideal for use in a course on electronics cooling. The author also believes it is well-suited for a first course in heat transfer where applications are as important as theory.

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