Encapsulation Technologies for Electronic Applications(Materials and Processes for Electronic Applications)

电子技术

售   价:
1927.00
发货周期:预计4-6周发货
作      者
出  版 社
出版时间
2018年10月01日
装      帧
平装
ISBN
9780128119785
复制
页      码
550
语      种
英文
版      次
2nd ed.
综合评分
暂无评分
我 要 买
- +
库存 48 本
  • 图书详情
  • 目次
  • 买家须知
  • 书评(0)
  • 权威书评(0)
图书简介
Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly ’green’ encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic.
本书暂无推荐
本书暂无推荐
看了又看
  • 上一个
  • 下一个