Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics:Symposium Held April 10–12, 2007, San Francisco, California, U.S.A.(MRS Proceedings)

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作      者
出  版 社
出版时间
2014年06月01日
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平装
ISBN
9781107408715
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229×152×19mm
语      种
英文
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图书简介
This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics.
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