3D Integration for VLSI Systems

工程热物理

售   价:
1260.00
发货周期:预计5-7周发货
出  版 社
出版时间
2011年09月26日
装      帧
精装
ISBN
9789814303811
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页      码
378
开      本
6x9
语      种
英文
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图书简介
Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC). Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers that are vertically bonded and interconnected by through silicon via TSV. This book presents contributions by key researchers in this field, covering motivations, technology platforms, applications, and other design issues.
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